DO-32682/EP/ESE - Wafer Testing of LDQ10 ASICs

This Technical Specification concerns the supply of wafer testing of LDQ10 ASICs. This includes the provision of an appropriate wafer probe card for the automatic wafer prober that will be used to test 12 wafers each containing approximately 9 000 dice. The LDQ10 test system will be provided by CERN and will be interfaced for pass/fail to the automatic wafer prober in order to sort the tested dice. The testing is foreseen over four weeks from notification of the Contract.

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