DO-32478/EP/ESE – Supply of packaging of the picoTDC V2 Integrated Circuit
Opening date
May 29, 2020
Closing date
June 26, 2020
Type
Price Inquiry (DO)
Research Facility
CERN
This technical specification concerns the custom design and production
assembly of a package for the picoTDC V2 integrated circuit. This includes
the wafer processing (thinning, dicing and chip extraction), package substrate
(design, simulation and manufacturing) and the assembly/bonding of
picoTDC V2 integrated circuits on the substrates.
External link to procurement, here
