DO-32478/EP/ESE – Supply of packaging of the picoTDC V2 Integrated Circuit

This technical specification concerns the custom design and production assembly of a package for the picoTDC V2 integrated circuit. This includes the wafer processing (thinning, dicing and chip extraction), package substrate (design, simulation and manufacturing) and the assembly/bonding of picoTDC V2 integrated circuits on the substrates.

External link to procurement, here