CFT-003027 ( DDP - TSV Processing of Medipix3 wafers)

This call for tender concerns the fabrication, inspection, packaging and delivery at ESRF of TSV-processed Medipix3RX [1] pixel readout chips, using standard Medipix3RX 200 mm CMOS wafers to be provided by ESRF. This requires in particular a proven expertise in wafer-scale processing techniques known as “Through-Silicon-Via last” (TSV-last) and “Under-Bump-Metallization” (UBM), as well as small-scale production capabilities. Previous experience of the suppliers in successful application of those processes to Medipix3 wafers will be an important criterion in the tender selection.

External link to procurement, here