582477-2026 - Competition Germany – Laboratory, optical and precision equipments (excl. glasses) – Flip Chip Die Bonder

Opening date

September 21, 2026

Closing date

September 22, 2026

Type

Tender

Research Facility

FAIR

External link to procurement, here

More information

If you require any further information, feel free to contact me.

Dr Adam Wikström

Business Developer & Project Manager

Contact point: EISCAT

adam.wikstrom@bigsciencesweden.se

+46 702 35 83 10