[25-9] DIAMOND SAW MACHINE

The diamond saw machine should be capable of machining both the inner and outer contours in silicon crystals. For the inner contour, this means that the wire should be open, and the saw should operate in a reciprocating manner. The maximum dimensions of the silicon parts can be up to 350mm x 350mm x 350mm. The cutting precision must be better than 0.2mm for a silicon part height of 100mm. The machine should be deliver with one year of consumables.