IN-VESSEL: Tungsten Tiles Supply And Bonding Market Survey

However, the ITER project has recently decided to replace the armour material from Be to W, as highlighted in Figure 1.3. The motivations for the change are based on economical, health and safety and performance related reasons. This has led into a need to develop a new bonding technology for the W tiles to the CuCrZr Heat Sink. In the past, the joining of the Be armour has been the last HIP Diffusion Bonding stage and it is believed that the W armour can be bonded in similar manner as a last stage. Preliminary assessments are suggesting the following as a promising approach for the FWP W armour bonding sequence, Figure 2.1: 1. Fabricate W/Cu -tile assemblies. These could be either in form of one singular tile or an array of multiple tiles in the same assembly. 2. Bond the W/Cu -tile assemblies onto SSt/CuCrZr FWP structure. This second step would be, essentially, bonding of Cu to CuCrZr, which is a known technique.

External link to procurement, here